Leveraging years of stacked BSI sensor production, Tower’s wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as Co-Packaged Optics, including ...

Tower Semiconductor announced that it received the Industry Paper Competition Award at the 2025 IEEE International Microwave Symposium for its paper on a low-loss, wideband RF switch technology ...

Tower ( (TSEM)) just unveiled an announcement. On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across ...

Company will participate and present at APEC 2026, highlighting recent advancements in its power management platform for AI processor power delivery and emerging high-current applications MIGDAL ...

Tower Semiconductor announced its participation in the International Microwave Symposium (IMS) 2025, where it will showcase its advanced RF technology and present a jointly developed white paper with ...

MIGDAL HAEMEK, Israel, March 5, 2025 – Tower Semiconductor (TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its participation in the upcoming 2025 Applied Power ...