Samsung Electronics and SK hynix are accelerating the development of next-generation three-dimensional (3D) dynamic random-access memory (DRAM), with both companies aiming to complete and test early ...

Scratch-pad memory (SPM) has been widely used in embedded systems because it allows software-controlled data placement. By designing data placement strategies, optimal solutions with minimal memory ...

Something to look forward to: The memory industry is known for its conservative approach, often favoring incremental improvements over revolutionary changes. But as we look toward the end of the ...

HONG KONG, Dec. 26, 2024 /PRNewswire/ -- Nano Labs Ltd (NA) ("we," the "Company," or "Nano Labs"), a leading fabless integrated circuit design company and product solution provider in China, today ...

A new technical paper titled “Revisiting DRAM Read Disturbance: Identifying Inconsistencies Between Experimental Characterization and Device-Level Studies” was published by researchers at ETH Zurich. ...

NEO's IGZO-based 3D X-DRAM delivers up to 512Gb density and 450-second retention with ultra-low power consumption — built on 3D NAND-compatible processes and optimized for AI, in-memory computing, and ...

A new power supply technology for 3D-integrated chips has been developed using a vertically stacked architecture, where processing units are positioned directly above dynamic random access memory ...